Title:
レーザ加工装置及び加工方法
Document Type and Number:
Japanese Patent JP7467821
Kind Code:
B2
Abstract:
To provide a laser processing apparatus and a processing method capable of improving productivity.SOLUTION: A laser processing apparatus includes: a laser beam irradiation part (12) irradiating laser beam to a processing line of an object (W) to be processed; a relative movement part (14) relatively moving the object to be processed and a laser beam irradiation part; a detection part detecting passage of an edge (WB) of the object to be processed at a light concentrating position (Lc) of laser beam in the relative movement in a first direction; and a movement control unit transmitting to the relative movement part a command signal applied to the relative movement from the first processing line to the second processing line. The movement control part starts relative movement from the first processing line to the second processing line with respect to the second direction after the light concentrating position of the laser beam passes the first edge of the object to be processed from inside the object to be processed. Moreover, until the relative movement in the second direction is completed, in processing in the second processing line, relative movement of the light concentrating position of the laser beam from outside the object to be processed to a second edge of the object to be processed is completed.SELECTED DRAWING: Figure 1
Inventors:
Masahide Ohkubo
Application Number:
JP2020018880A
Publication Date:
April 16, 2024
Filing Date:
February 06, 2020
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
B23K26/00; B23K26/03; B23K26/53; H01L21/301
Domestic Patent References:
| JP2008042032A | ||||
| JP2012161799A | ||||
| JP2012240082A | ||||
| JP62133304A | ||||
| JP2009076484A |
Foreign References:
| US20180076060 |
Attorney, Agent or Firm:
Kenzo Matsuura
Kazuki Ohara
Kiyoshi Matsumura
Constitutional Matsuura
Kazuki Ohara
Kiyoshi Matsumura
Constitutional Matsuura
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