Title:
レーザー加工装置及び位相パターンの調整方法
Document Type and Number:
Japanese Patent JP7386672
Kind Code:
B2
Abstract:
A laser processing apparatus includes a laser beam applying unit for applying a laser beam to a workpiece, and a control unit. The laser beam applying unit includes a laser oscillator for emitting a laser, a condensing lens, a concave mirror having a focal point at a focused spot of the condensing lens and having a spherical reflecting surface, a beam splitter for transmitting therethrough the laser beam emitted from the laser oscillator toward the condensing lens and branching off a reflected beam, and a wavefront measuring unit for receiving the reflected beam and acquiring wavefront data. The control unit changes a phase pattern to be displayed on a display portion of a spatial light modulator on the basis of the wavefront data.
Inventors:
Teppei Nomura
Atsushi Ueki
Atsushi Ueki
Application Number:
JP2019207274A
Publication Date:
November 27, 2023
Filing Date:
November 15, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B23K26/00; B23K26/067; H01L21/301
Domestic Patent References:
| JP2009034723A | ||||
| JP2017159333A | ||||
| JP2013088432A |
Attorney, Agent or Firm:
Sakai International Patent Office