Title:
レーザ加工装置
Document Type and Number:
Japanese Patent JP5266097
Kind Code:
B2
Inventors:
Iwao Hayashi
Hiroshi Onodera
Hiroshi Onodera
Application Number:
JP2009049524A
Publication Date:
August 21, 2013
Filing Date:
March 03, 2009
Export Citation:
Assignee:
Amada Co., Ltd.
International Classes:
B23K26/10; B23K26/38; B23K26/42; B23K7/10
Domestic Patent References:
| JP1148460A | ||||
| JP2070890U | ||||
| JP6246472A | ||||
| JP9001375A | ||||
| JP10058182A | ||||
| JP2000052091A | ||||
| JP2001087885A | ||||
| JP2001150175A | ||||
| JP2005152947A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu