Title:
レーザ加工方法及びレーザ加工装置
Document Type and Number:
Japanese Patent JP6984978
Kind Code:
B2
Abstract:
To provide a laser processing method and a laser processing device capable of shortening a processing time while restraining thermal influence received by a workpiece.SOLUTION: A laser processing method comprises an abrasion step and an oxidation layer removal step. The abrasion step forms a second processed surface having a projection part lower than a projection part of a first processed surface by removing the projection part of the first processed surface by irradiating the first processed surface having irregularities with a first pulse laser beam in an oxidative atmosphere that promotes oxidation. The oxidation layer removal step removes an oxidation layer by irradiating the oxidation layer formed on the second processed surface in the abrasion step with a second pulse laser beam different from the first pulse laser beam in an oxidation restraining atmosphere that restrains oxidation after the abrasion step.SELECTED DRAWING: Figure 19
Inventors:
Hiroshi Ishida
Takuro lacquer field
Tomotaka Wakabayashi
Yoshitaka Sugiyama
Yuichi Takushima
Takuro lacquer field
Tomotaka Wakabayashi
Yoshitaka Sugiyama
Yuichi Takushima
Application Number:
JP2018021670A
Publication Date:
December 22, 2021
Filing Date:
February 09, 2018
Export Citation:
Assignee:
Yazaki Corporation
International Classes:
B23K26/352; B23K26/14
Domestic Patent References:
| JP201177505A | ||||
| JP2012119669A | ||||
| JP2010134466A |
Attorney, Agent or Firm:
Toranomon Intellectual Property Office
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