Title:
レーザー加工方法、被加工物の分割方法およびレーザー加工装置
Document Type and Number:
Japanese Patent JP5510486
Kind Code:
B2
Inventors:
Nagatomo Shohei
Sugita Mitsuru
Ikusho Nakatani
Sugita Mitsuru
Ikusho Nakatani
Application Number:
JP2012067822A
Publication Date:
June 04, 2014
Filing Date:
March 23, 2012
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
B23K26/00; B23K26/38; B23K26/082; B23K26/36; B23K26/40; B28D5/00; H01L21/301
Domestic Patent References:
| JP2006320940A | ||||
| JP2008300645A | ||||
| JP2004179556A | ||||
| JP2005271563A | ||||
| JP2009166103A | ||||
| JP2002020134A |
Foreign References:
| WO2009057381A1 |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita