Title:
LASER PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2015229167
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a laser processing method capable of achieving a taper rate of about 80% or higher even in a case of boring processing with a carbon dioxide gas laser in which the thickness of a glass sheet is 100 μm.SOLUTION: In a laser processing method for boring a glass sheet having a thickness of 100 μm by using a carbon dioxide gas laser, the boring processing is preferably performed after pasting a resin film having a thickness of 125 μm on the surface. In the optimum condition in particular, it has been found that an excellent hole shape having a taper diameter of almost 80% and an opening diameter of almost 50 μm can be formed.
Inventors:
ICHIKAWA KENICHI
ITO YASUSHI
OKAZAKI MANABU
URABE KAORU
ITO YASUSHI
OKAZAKI MANABU
URABE KAORU
Application Number:
JP2014115334A
Publication Date:
December 21, 2015
Filing Date:
June 04, 2014
Export Citation:
Assignee:
VIA MECHANICS LTD
International Classes:
B23K26/382; C03B33/02