Title:
LASER PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2023108398
Kind Code:
A
Abstract:
To provide a laser processing method capable of suppressing deflection of cracks extending from a modified region while narrowing the width of a groove formed in an object.SOLUTION: A laser processing method includes the steps of irradiating a wafer 20 with a laser beam L to form a first groove M1 in the wafer 20 along a line 15, irradiating the wafer 20 with a laser beam L to form a second groove M2 in the wafer 20 along the line 15 such that the widthwise end of the first groove M1 overlaps with the first groove M1, and irradiating the wafer 20 with the laser beam L0 to form a modified region 11 along the line 15 inside the wafer 20 after forming a composite groove MH including the first groove M1 and the second groove M2 in the wafer 20, and extending a crack 9 from the modified region 11.SELECTED DRAWING: Figure 8
Inventors:
SAKAMOTO TSUYOSHI
SUGIMOTO AKIRA
OGIWARA TAKAFUMI
KURITA TAKASHI
YOSHIMURA RYO
SUGIMOTO AKIRA
OGIWARA TAKAFUMI
KURITA TAKASHI
YOSHIMURA RYO
Application Number:
JP2022009500A
Publication Date:
August 04, 2023
Filing Date:
January 25, 2022
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK
International Classes:
H01L21/301; B23K26/53; H01L21/304
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Kenichi Shibayama
Toshio Arai
Yoshiki Kuroki
Kenichi Shibayama
Toshio Arai