To provide a laser scribing apparatus and method by which formation of a scribing line without deviating from a planned cutting line can be confirmed while formation of the scribing line is performed.
The laser scribing apparatus (10) is structured so that a scribing line (SB) is formed on a planned cutting line (J) by relatively moving a laser beam (L1) and a substrate (K) to be cut, in a manner following the planned cutting line (J) in the substrate (K) to be cut. The apparatus (10) is characterized in that it includes a laser displacement sensor (1) which, immediately after the formation of the scribing line (SB), detects the depth and position of a crack occurrence part (R) in the scribing line (SB) in real time to output the detection data (S1), and that it includes a discrimination means (4) which discriminates formation of a normal scribing line, on the basis of the detection data (S1) output by the laser displacement sensor (1).
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