Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
LASER SCRIBING APPARATUS AND METHOD
Document Type and Number:
Japanese Patent JP2009172669
Kind Code:
A
Abstract:

To provide a laser scribing apparatus and method by which formation of a scribing line without deviating from a planned cutting line can be confirmed while formation of the scribing line is performed.

The laser scribing apparatus (10) is structured so that a scribing line (SB) is formed on a planned cutting line (J) by relatively moving a laser beam (L1) and a substrate (K) to be cut, in a manner following the planned cutting line (J) in the substrate (K) to be cut. The apparatus (10) is characterized in that it includes a laser displacement sensor (1) which, immediately after the formation of the scribing line (SB), detects the depth and position of a crack occurrence part (R) in the scribing line (SB) in real time to output the detection data (S1), and that it includes a discrimination means (4) which discriminates formation of a normal scribing line, on the basis of the detection data (S1) output by the laser displacement sensor (1).


Inventors:
Tsuneyoshi, Takeshi
Application Number:
JP2008000016658
Publication Date:
August 06, 2009
Filing Date:
January 28, 2008
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TORAY ENG CO LTD
International Classes:
B23K26/00; B28D5/00; C03B33/09; H01L21/301; B23K26/00; B28D5/00; C03B33/00; H01L21/02