To provide a laser scribing method and a laser scribing device, capable of preventing such a situation that a part in the vicinity of the end face of a to-be-cleaved lamination type substrate, where a scribing treatment is conducted along a scheduled scribing line, is cleaved exceeding the scribing treatment part.

By re-irradiating a part in the vicinity of the end face of the to-be-cleaved substrate 10 with a laser beam after a first face of the to-be-cleaved substrate 10 is subjected to a laser scribing treatment, a part in the vicinity of the end face of the to-be-cleaved substrate in the laser-scribing treatment region is rewelded. By re-irradiating a part 116, where a first direction and a second direction of the surface of the to-be-cleaved substrate are crossed, with a laser beam, the part of the scribing region where the first direction and the second direction are crossed is rewelded.