To provide a laser scribing method which can prevent an occurrence of air breakdown without lessening a forming range of a reformed region.
The laser scribing method of a quartz crystal substrate 10 comprises an inserting step to insert a quartz glass plate 8 in a laser machining apparatus 1, wherein the quartz glass plate 8 gives on-axis aberration to the laser beam 4 having wavelength dispersion characteristics and controls the laser intensity P at the condensing point 32 of the laser beam 4 more than a formation threshold P1 of a reformed region but less than a possible occurrence threshold P2 of air breakdown, an adjusting step to adjust a position of the condensing point 32 so that the condensing point 32 of the laser beam 4 stays inside the quartz crystal plate 10, and a scanning step in which the quartz crystal substrate 10 and the laser beam 4 are relatively moved along a designated cutting line 43 in the X axis direction and a designated cutting line 44 in the Y axis direction, in order to form the reformed region by irradiating the laser beam 4.
UMETSU KAZUNARI
| JP2005243977A | 2005-09-08 | |||
| JP2004337903A | 2004-12-02 | |||
| JP2005138143A | 2005-06-02 | |||
| JP2006326640A | 2006-12-07 |
| WO2005084874A1 | 2005-09-15 |
Fujitsuna Hideyoshi
Osamu Suzawa
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