Title:
LASER TRIMMING METHOD FOR CHIP RESISTOR
Document Type and Number:
Japanese Patent JP3825183
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To shorten a time required for laser trimming plural resistance films formed on the surface of a material board.
SOLUTION: The surface of a material board A is divided into plural unit areas including plural resistance films 13a, 13b, and 13c adjacent to each other among plural resistance films on the surface, and laser trimming for simultaneously carving trimming grooves 13a', 13b', and 13c' on each resistance film 13a, 13b, and 13c in one unit area by radiating those resistance films with laser beams for setting the resistance value of at least one resistance film 13a in one unit area as a prescribed value is operated to all the unit areas.
Inventors:
Masashi Shiba
Application Number:
JP26445798A
Publication Date:
September 20, 2006
Filing Date:
September 18, 1998
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01C17/22; H01C17/242; (IPC1-7): H01C17/242; H01C17/22
Domestic Patent References:
| JP3114204A | ||||
| JP4190993A |
Attorney, Agent or Firm:
Akio Ishii
Tadashi Higashino
Hiroyuki Nishi
Tadashi Higashino
Hiroyuki Nishi