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Title:
LASER TYPE THICKNESS MEASUREMENT SYSTEM AND CALIBRATION METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2013137197
Kind Code:
A
Abstract:

To provide a laser type thickness measurement system that removes an influence of a measurement error due to variation in distance between support points of a laser range finder with temperature, does not require special safety management, and can perform continuous measurement, and a calibration method therefor.

Laser type thickness measurement devices 1 and 2 are set at a predetermined interval Ld, and an operation mode setting unit sets "measurement" to a first laser type thickness measurement device and commands the other second laser type thickness measurement device located downstream in a movement direction to start "thickness correction" processing while the first laser type thickness measurement device executes thickness calibration processing with a thickness reference plate and the second laser type thickness measurement device executes measurement processing. A first thickness measurement value is delayed up to a position corresponding to the interval in the movement direction, the difference between the first thickness measurement value and a second thickness measurement value of the second laser type thickness measurement device is found as a correction value, and a thickness correction is made without interrupting the measurement by the second laser type thickness measurement device.


Inventors:
FURUTA TETSUO
ISHIZUKA TERUO
Application Number:
JP2011287010A
Publication Date:
July 11, 2013
Filing Date:
December 27, 2011
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
G01B11/06
Domestic Patent References:
JP2000081328A2000-03-21
JP2003227707A2003-08-15
JP4131843B22008-08-13
JPS62287114A1987-12-14
Attorney, Agent or Firm:
Fujiwara Yasutaka