Title:
LASER WORKING METHOD
Document Type and Number:
Japanese Patent JP2014042921
Kind Code:
A
Abstract:
To provide a laser working method capable of peeling a portion of a working object into a desired shape by the irradiation of a laser beam.
Prior to the step of peeling a peel-planned part 10 from a working object 1 by the irradiation of a laser beam L1, a crack 8 is formed along a reference line BL specifying the peel-planned part 10. Thus, at the step of peeling the peel-planned part 10, the peel-planned part 10 can be peeled along that crack 8. By controlling the modes of the reference line BL and the crack 8, therefore, the peel-planned part 10 can be peeled into a desired shape.
Inventors:
SHIMOI HIDEKI
ARAKI KEISUKE
ARAKI KEISUKE
Application Number:
JP2012185679A
Publication Date:
March 13, 2014
Filing Date:
August 24, 2012
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK
International Classes:
B23K26/36; B23K26/40; B23K26/60; B23K26/70; B28D5/00; C03B33/09; C03C23/00
Domestic Patent References:
| JP2008018547A | 2008-01-31 | |||
| JP2013144312A | 2013-07-25 | |||
| JP2011098384A | 2011-05-19 | |||
| JP2009066851A | 2009-04-02 | |||
| JP2005268752A | 2005-09-29 | |||
| JP2008018547A | 2008-01-31 |
Foreign References:
| WO2009050938A1 | 2009-04-23 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Satoru Ishida
Yoshiki Kuroki
Satoru Ishida