Title:
PACKAGING STRUCTURE FOR SMALL SOLID OBJECT AND ERASER
Document Type and Number:
Japanese Patent JP3162287
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a packaging structure in packaging a small solid object such as an eraser wherein a breaking tape is not used and a material cost and also a manufacturing cost can be reduced.
SOLUTION: A structure for coating and packaging a surface of an eraser body 1 of a plastic eraser with a packaging film 2 includes the packaging film 2 formed with a breaking part 5 which can be broken by predetermined tensile force linearly around an entire periphery of one of peripheral directions of the eraser body 1. By elastically deforming the eraser body 1, the packaging film 2 may be broken and opened along the braking part 5.
Inventors:
Yasuo Matsumae
Kazutomi Ogawa
Kazutomi Ogawa
Application Number:
JP7144896A
Publication Date:
April 25, 2001
Filing Date:
February 29, 1996
Export Citation:
Assignee:
Seed Rubber Industry Co., Ltd.
International Classes:
B43L19/00; B65D65/26; (IPC1-7): B65D65/26; B43L19/00
Domestic Patent References:
| JP61127459A | ||||
| JP6183481A | ||||
| JP59133465U | ||||
| JP62108234U | ||||
| JP61105683U | ||||
| JP475160B2 |
Attorney, Agent or Firm:
Shogo Sano (1 person outside)