Title:
MANUFACTURE OF FLEXIBLE PRINTED WIRING BOARD FITTED WITH COVERLAY FILM
Document Type and Number:
Japanese Patent JPH057067
Kind Code:
A
Abstract:
PURPOSE: To provide a flexible printed wiring board fitted with a coverlay film, which is excellent in its thermal resistance to soldering and in its resistibility to curling.
CONSTITUTION: To both the surfaces of a polyimide film, whose one side is subjected to a plasma processing, applied is a bonding agent made of a polyimide resin or the precursor thereof, and the bonding agent is dried. Then, after the conductor circuit surface of a flexible printed wiring board is thermocompression-bonded to the surface subjected to the plasma processing, the bonding agent on the opposite surface of the polyimide film to the surface subjected to the plasma processing is peeled and is removed.
Inventors:
SUZUKI MASAKATSU
IMAIZUMI JUNICHI
NAGAO KOICHI
KATO YASUSHI
NOMURA HIROSHI
OCHI TAKAHITO
SATO EIKICHI
IMAIZUMI JUNICHI
NAGAO KOICHI
KATO YASUSHI
NOMURA HIROSHI
OCHI TAKAHITO
SATO EIKICHI
Application Number:
JP31781891A
Publication Date:
January 14, 1993
Filing Date:
December 02, 1991
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H05K3/20; B32B15/08; C08G73/10; C08J7/043; C09J179/08; H01B3/30; H05K3/28; H05K3/38; H05K1/00; (IPC1-7): H05K3/20; H05K3/28; H05K3/38
Attorney, Agent or Firm:
Kunihiko Wakabayashi