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Title:
LAYER-BUIT WIRING BODY AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPS59155902
Kind Code:
A
Abstract:

PURPOSE: To reduce the occupied area for the layer-built wiring by omitting the space for connection of conductive patterns among insulating sheets by improving the insulating sheet of a generating coil or a driving of a brushless system, a linear motor or the like.

CONSTITUTION: In a coil of a brushless system, a linear motor or the like, a pattern conductor 35 has thickness of 10W200μm and is formed as an insulating sheet 31 of 30μm or less thick. Three of this sheet 31 are laminated to form a layered body and then a bonding conductive layers 45 and 46 are formed on all of the parts for the bonding of the sheets 31. Using these bonding conductive layers 45 and 46 as pattern conductors, a through-hole 94 is formed on the bonding conductive layer 46. Then the various bonding conductors are driven into the through-hole 94. The inside circumferential surface of these conductors and that of the through-hole 94 of each bonding conductive layers 45 and 46 are connected with soldering. Consequently, the space for connection of the conductive patterns among the insulating sheets becomes unnecessary, thereby reducing the occupied area for the layer-built wiring.


Inventors:
SUDOU MITSUO
SEKINE TADASHI
Application Number:
JP3143283A
Publication Date:
September 05, 1984
Filing Date:
February 25, 1983
Export Citation:
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Assignee:
KANGYO DENKI KIKI KK
International Classes:
H05K3/46; H01F5/00; H01F41/04; H02K3/04; H02K3/26; (IPC1-7): H01F5/00; H01F41/04; H02K3/04; H05K3/46
Attorney, Agent or Firm:
Kusano Takashi



 
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