Title:
LAYER PICKING APPARATUS
Document Type and Number:
Japanese Patent JP3945330
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To provide a layer picking apparatus installable in a saved space and capable of performing a picking operation without collapsing a piled-up load style of product layers.
SOLUTION: This layer picking apparatus comprises a transfer arm 3 movable along a rail 3d installed in the upper space of a depalletizer 1 and a palletizer 2 and having a rotating arm 3a retractable in the upper space of the product layers W by the rotation around a rotating pivot 3b. The transfer arm 3 functions, when dismounted by the depalletizer 1, as a dismounting arrangement stopper so that the product layers W are not collapsed and, when transferred to from the depalletizer 1 to the palletizer 2, as an arrangement conveying arm, and, when piled up by the palletizer, as an arrangement stopper so that the product layers W are not collapsed.
More Like This:
| JP07025409 | CONVEYOR FOR PRINTED CIRCUIT BOARD |
| JP08113365 | TEMPORARY PRODUCT STORAGE DEVICE AND METHOD |
| JP2001173256 | STACKING/UNSTACKING APPARATUS |
Inventors:
Nishina, Yoshiaki
Yoshinaga, Yoichi
Shoda, Kensho
Ihara, Shigeyuki
Yoshinaga, Yoichi
Shoda, Kensho
Ihara, Shigeyuki
Application Number:
JP2002000207377
Publication Date:
April 20, 2007
Filing Date:
July 16, 2002
Export Citation:
Assignee:
JFE ENGINEERING KK
International Classes:
B65G60/00; B65G57/10; B65G59/02; B65G60/00; B65G57/02; B65G59/02; (IPC1-7): B65G60/00; B65G57/10; B65G59/02
Previous Patent: EVAPORATING FUEL TREATMENT DEVICE FOR ENGINE
Next Patent: PICKUP DEVICE AND ATTRACTION PEELING TOOL FOR SEMICONDUCTOR CHIP
Next Patent: PICKUP DEVICE AND ATTRACTION PEELING TOOL FOR SEMICONDUCTOR CHIP