Title:
層状物体厚さ測定方法
Document Type and Number:
Japanese Patent JP7406195
Kind Code:
B2
Abstract:
To provide a laminar object thickness measurement method that can have a sufficient measurement speed and can be flexibly adaptive to change in measurement target film thickness etc.SOLUTION: There is provided a method of measuring a thickness of a laminar object for example, a dielectric film 2 which is layered on a metal plate 1, and transmits at least a part of a microwave. The method comprises a microwave transmission/reception device 3 having: a horn antenna 5 as a transmission/reception antenna; and a transmission/reception circuit 6 which generates and supplies an electric signal of a microwave to the horn antenna 5, and receives as input, the electric signal of the microwave received by the horn antenna 5. The laminar object thickness measurement method includes: making the microwave 7 incident substantially vertically on a surface of the dielectric film 2 while sweeping a frequency; detecting a frequency at which a reflected wave 8 from the dielectric film 2 has maximum or minimum intensity; and calculating a thickness of the dielectric film 2 based upon the detected frequency.SELECTED DRAWING: Figure 1
Inventors:
Satoru Kurokawa
Yoshikazu Toba
Yoshikazu Toba
Application Number:
JP2020087478A
Publication Date:
December 27, 2023
Filing Date:
May 19, 2020
Export Citation:
Assignee:
7Gaa Co., Ltd.
Seiko Giken Co., Ltd.
Seiko Giken Co., Ltd.
International Classes:
G01B15/02
Domestic Patent References:
| JP5196446A | ||||
| JP2006250634A | ||||
| JP2017053731A | ||||
| JP2018077192A | ||||
| JP2017025387A |
Foreign References:
| US7339382 |
Attorney, Agent or Firm:
Mitsukazu Kondo
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