Title:
含金属材料の層状構成
Document Type and Number:
Japanese Patent JP6623177
Kind Code:
B2
Abstract:
The present disclosure is directed at alloys and method for layer-by-layer deposition of metallic alloys on a substrate. The resulting deposition provides for relatively high hardness metallic parts with associated wear resistance. Applications for the metallic parts include pumps, valves and/or bearings.
Inventors:
Charles Di Tuffill
Harald Remke
Harald Remke
Application Number:
JP2016568008A
Publication Date:
December 18, 2019
Filing Date:
May 18, 2015
Export Citation:
Assignee:
The Nanosteel Company, Inc.
International Classes:
B22F7/02; B22F3/16; B23K26/21; B23K26/34; B32B15/01; C22C38/00; F16C33/12
Domestic Patent References:
| JP2005524776A |
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mitsuhiro
Tatsuhiko Abe
Shinya Mitsuhiro
Tatsuhiko Abe