Title:
LEAD CUT DEVICE
Document Type and Number:
Japanese Patent JP3023626
Kind Code:
B2
Abstract:
PURPOSE: To provide the title lead cut device capable of easily taking out an electronic unit part stampped out downward from a manufacturing frame while stabilizing the attitude thereof furthermore avoiding the lead deformation.
CONSTITUTION: The title lead cut device is provided with a punch 8 and a die 15 relatively close alienated in the vertical direction furthermore, within the slidable die 15 in the lateral direction, a stripper 18 energized upward to be protruded from the upper end of the die 15 in the natural state is vertically slidably interpolated into the central hole of the die 15.
Inventors:
馬場 ▲龍▼
Application Number:
JP19250692A
Publication Date:
March 21, 2000
Filing Date:
July 20, 1992
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
B21D28/14; H01L23/50; (IPC1-7): H01L23/50
Domestic Patent References:
| JP6284837A | ||||
| JP57166350U |
Attorney, Agent or Firm:
Minoru Yoshida (2 outside)