Title:
LEAD CUTTER
Document Type and Number:
Japanese Patent JP2944592
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent production of defective products due to residue clogging by forming a taper for bending unwanted leads to be cut at the opening top of a die, and forming cutting blades at the sides of a punch and die where outer leads are cut and left.
SOLUTION: A die 2 has a taper 2A for bending unwanted leads to be cut at the top of opening 3. A punch 4 and the die 2 have cutting blades at the sides where outer leads are cut and left. A lead frame having a package 10 contg. a sealed semiconductor pellet is set in a pad 1 and the die 2, upper die is lowered to fix the lead frame with the pad 1, a punch 4 is lowered to cut leads of a product with leaving outer leads 5A and depress and bend down unwanted leads 5B of the frame. This permits tests to be executed at later steps, without producing dust from cutting.
Inventors:
IKURA JUNJI
Application Number:
JP26011797A
Publication Date:
September 06, 1999
Filing Date:
September 25, 1997
Export Citation:
Assignee:
OOITA NIPPON DENKI KK
International Classes:
H01L23/50; B21D28/00; (IPC1-7): H01L23/50; B21D28/00
Domestic Patent References:
| JP4219961A | ||||
| JP8204090A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)
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