Title:
LEAD FRAME AND BEAD FILTER AND MANUFACTURE OF BEAD FILTER
Document Type and Number:
Japanese Patent JP2694490
Kind Code:
B2
Abstract:
PURPOSE: To provide a lead frame and a bead filter capable of preventing the generation of insulation failure attributable to adhesive coating and the generation of troubles, such as lack of adhesion strength.
CONSTITUTION: Lead frames 10 are attached to a base end connecting part at a specified span in such a fashion that their tip may serve as a free end while they provide a plurality of leads 12 capable of inserting a ferrite core having an insertion hole. There is formed a slit-shaped adhesive sump 12b in the central part of the leads 12. When manufacturing a bead filter, using this lead frame 10, the ferrite core is inserted into the leads 12 in such a fashion that the adhesive sump 12b may be included after a proper amount of adhesive is applied to the adhesive sump 12 where the adhesive sump 12 inhibits the flow of the adhesive and prevents the generation of insulation failure attributable to the adhesive coating and troubles, such as lack of adhesion strength.
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Inventors:
Shinji Osuka
Tadashige Konno
Tadashige Konno
Application Number:
JP18507692A
Publication Date:
December 24, 1997
Filing Date:
July 13, 1992
Export Citation:
Assignee:
TDK Corporation
International Classes:
H01F27/29; H01F17/06; H01F41/10; (IPC1-7): H01F17/06; H01F27/29; H01F41/10
Domestic Patent References:
| JP3125413A | ||||
| JP6247102A |
Attorney, Agent or Firm:
Masayoshi Misawa