Title:
LEAD FRAME AND CONNECTOR
Document Type and Number:
Japanese Patent JP2016011457
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a lead frame and a connector having both of high conductivity and high intensity.SOLUTION: A lead frame contains 0.2 mass% to 0.6 mass% (inclusive) of iron, 0.02 mass% to 0.06 mass% (inclusive) of nickel, 0.07 mass% to 0.3 mass% (inclusive) of phosphorus, 0.01 mass% to 0.2 mass% (inclusive) of magnesium and 0.001 mass% to 0.005 mass% (inclusive) of zinc and the balance copper with inevitable impurities and having conductivity of 75%IACS or more and 0.2% bearing force of 500 MPa or more.
Inventors:
YAMAMOTO YOSHINORI
SEKI SOSHI
SEKI SOSHI
Application Number:
JP2015010772A
Publication Date:
January 21, 2016
Filing Date:
January 23, 2015
Export Citation:
Assignee:
SH COPPER PRODUCTS CORP
International Classes:
C22C9/00; H01L23/48
Attorney, Agent or Firm:
Hiroshi Okikawa