Title:
LEAD FRAME CONTINUOUS MANUFACTURING DEVICE
Document Type and Number:
Japanese Patent JP3020126
Kind Code:
B2
Abstract:
PURPOSE: To enable a lead frame excellent in shape to be manufactured high in yield by a method wherein a press which punches a part of a lead pattern out of a metal thin plate, a pasting device which pastes a dry photoresist film, a positioning device which positions the photoresist film, and a device which prints, develops, and etches a lead pattern are provided.
CONSTITUTION: An outer lead and a guide hole are punched out of a metal thin plate 2 wound off from an unwinding reel 4 by a press 1. In succession, a slave rotation pasting device 6 is rotated coming into contact with the metal thin plate 2 which passes between the device 6 and a support roll 9 to paste a dry photoresist film on the metal plate 2 matching the feed speed of the metal thin plate 2. A positioning device 10 detects guide holes at a prescribed interval to feed the metal thin plate 2 so as to make the guide hole coincident with a reference pilot of a pattern printing device 12, and the patterns of the inner leads, pads, and support bars are printed. Then, a photoresist mask is formed by developing, and the rest of a lead pattern is formed by etching.
Inventors:
Toshiya Matsubara
Riki Araki
Riki Araki
Application Number:
JP17466492A
Publication Date:
March 15, 2000
Filing Date:
May 22, 1992
Export Citation:
Assignee:
Mitsui High Tech Co., Ltd.
International Classes:
C23F1/08; G03F7/16; G03F7/20; H01L23/50; (IPC1-7): H01L23/50; C23F1/08
Domestic Patent References:
| JP63148667A | ||||
| JP494157A | ||||
| JP3136267A | ||||
| JP3159161A |
Attorney, Agent or Firm:
Takahisa Kimura