PURPOSE: To eliminate the short-circuit fault caused by the contact of a bus bar and a bonding wire and to omit coining machining for an inner lead at the time of wire bonding.

CONSTITUTION: A part of the press punching direction of a lead is reversed, and the extruding direction of burr 7 of an inner lead 2 of a lead frame and the extruding direction of burr 7 of a bus bar 1 are inverted. The lead frame is bonded on a semiconductor chip 4 through an insulating film 3 so that the burr surface of the inner lead 2 is positioned at the upper side and the burr surface of the bus bar 1 is positioned at the lower side. The bonding pad of a semiconductor chip 4 and the inner lead 2 are bonded with a bonding wire 5 beyond the bus bar 1. Since the edge of the bus bar 1, on which the bonding wire 5 exceeds, is drooped, the large separating distance can be provided.