Title:
LEAD FRAME HEATING DEVICE
Document Type and Number:
Japanese Patent JPH0290630
Kind Code:
A
Abstract:
PURPOSE: To prevent the burning of a protective tape in a heating device by a method wherein the guide member of a lead frame is cooled down, and the temperature of the part where the protective tape is adhered can be kept low.
CONSTITUTION: A cooling water feeding hole 10 is formed in a cooling block 6, and the guide rails on both sides are cooled by the cooling water. Moreover, the width of the upper part of a heater block 5, to be used to heat a die pad part, is formed as narrow as possible, a gap (a) is provided ranging over a wide space between a lead frame 3 and guide rails 7, and the conduction of heat to the region other than the die pad part is prevented as much as possible.
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Inventors:
TAKAOKA KIYOSHI
Application Number:
JP24350988A
Publication Date:
March 30, 1990
Filing Date:
September 28, 1988
Export Citation:
Assignee:
MATSUSHITA ELECTRONICS CORP
International Classes:
H01L21/52; H01L23/50; (IPC1-7): H01L21/52; H01L23/50
Attorney, Agent or Firm:
Yoshihiro Morimoto
Next Patent: JPH0290631