PURPOSE: To make it possible to prevent deformation of a lead produced when a lead frame is machined and protect the lead of a semiconductor device from deformation where the lead is bending-formed in a specific shape and mount the lead definitely.

CONSTITUTION: In a lead frame 10 adopted for a resin-sealed type semiconductor device, resin 14 is filled in between leads 12 comprising an inner lead 12a and an outer lead 12b where the resin is provided with an electric insulation property and flexibility which allows bending work. In addition, the surfaces of the leads are coated with resin on the dam bar 20 portion of the lead frame so as to prevent resin leakage when sealing the lead frame with resin, thereby resin-molding is obtained at a fixed thickness.