To provide a lead frame having the shape of an inner lead tip with excellent wire bonding property and its processing method.

The front and back resist patterns of a lead frame 120 are respectively connected to resist parts 131, 132 in a mutually separated state to form the inner lead tips 112 also providing a subsidiary resist part 135 on the periphery thereof furthermore, the intervals between the subsidiary resist part 135 and the resist parts to form the inner lead tips 112 are made almost equal to the intervals between mutual resist parts 131, 132 to form the inner lead tips 112. Besides, the etching contour processing step is performed by etching away the contour using the front and back resist patterns as etching resist mask so as to provide needless parts integrally connected to a die pad 111. Finally, the metal mold press step is performed to cut off the needless parts integrally connected to the die pad 111 so as to form the die pad part 111 in a specific shape.