Title:
LEAD FRAME AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3069621
Kind Code:
B2
Abstract:
PURPOSE: To provide a lead frame having the excellent reliability, by which a chip can be mounted on the specified position of a pad accurately and quickly, wire bonding can be performed at a high speed even if the number of pins is large, a bonding wire can be made short, and the thermal stress, which is generated by the thermal expansion difference by temperature rising at resin sealing and fixing and the like, is released.
CONSTITUTION: In a lead frame 1, wherein a part in a pad is lowered, a slit 7 is formed at a part other than the parts of the corners at planned four sides surrounding a planned chip mounting place 8. The cut part of the slit is lowered and bent. The planned chip mounting place 8 is lowered in this lead frame 1.
Inventors:
Youichi Taura
Kazuyuki Nagahama
Shiga Ryutoku
Toshiharu Yoshiyanagi
Kazuyuki Nagahama
Shiga Ryutoku
Toshiharu Yoshiyanagi
Application Number:
JP35819092A
Publication Date:
July 24, 2000
Filing Date:
December 25, 1992
Export Citation:
Assignee:
Mitsui High Tech Co., Ltd.
International Classes:
H01L21/52; H01L23/50; (IPC1-7): H01L23/50
Domestic Patent References:
| JP284758A | ||||
| JP422162A |
Attorney, Agent or Firm:
Takahisa Kimura