Title:
LEAD FRAME AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP3696820
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a lead frame which is manufactured by press working with a precision press die and is used for a leadless package.
SOLUTION: A lead frame 50 comprises a lead part 50a which, extending as a comb inwardly from the frame part 50b, comprises a tip part 30a, a central part 30, and a base part 30b connected to the frame part 50b. The tip part 30a connects to the central part 30 through a first constricted part while the central part 30a connects to the base part 30b through a second constricted part. The tip part 30a and both side parts 30c at the central part 30 of the lead part 50a are thinner than other part of the lead part 50a.
More Like This:
| JPH0494565 | SEMICONDUCTOR DEVICE |
Inventors:
Hideki Matsuzawa
Hideto Sotani
Hiroyuki Komatsu
Inatsutsu Tatsuya
Abe Shin
Hideto Sotani
Hiroyuki Komatsu
Inatsutsu Tatsuya
Abe Shin
Application Number:
JP2001312199A
Publication Date:
September 21, 2005
Filing Date:
October 10, 2001
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
H01L23/50; H01L21/44; H01L21/48; H01L23/48; H01L23/495; (IPC1-7): H01L23/50
Domestic Patent References:
| JP2026270U | ||||
| JP3212963A | ||||
| JP4044255A | ||||
| JP5275591A | ||||
| JP57196554A | ||||
| JP2000164788A | ||||
| JP2000196004A | ||||
| JP2000349219A | ||||
| JP2001077282A |
Foreign References:
| WO2001003186A1 |
Attorney, Agent or Firm:
Keizo Okamoto