Title:
LEAD FRAME AND MANUFACTURING THEREOF
Document Type and Number:
Japanese Patent JPS6276749
Kind Code:
A
Abstract:
PURPOSE: To improve the bondability of a frame face with seaing resin by forming uniform satinlike irregular surface on the frame face in the predetermined region inside from the profile end of a resin enclosure.
CONSTITUTION: A lead frame 1 in which the entire region 71 or a hollow region 72 is formed in satinlike state by rolling is used. However, the inner and bonding region of inner leads 4 and the back surface of a head 3 are not machined. Since satinlike irregular surfaces are formed on inner leads 4, a tie bar 6 and the head 3, the bondability to resin is increased, moisture transmitted to outer lead 5 does not arrive at the inner ends of the inner leads to improve moisture resistance.
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Inventors:
MINAMI KENJI
KATAGIRI MASARU
KATAGIRI MASARU
Application Number:
JP21680785A
Publication Date:
April 08, 1987
Filing Date:
September 30, 1985
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L23/50; H01L21/48; H01L23/495; (IPC1-7): H01L23/48
Attorney, Agent or Firm:
Kazuo Sato