Title:
LEAD FRAME AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP3854208
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a lead frame and a method of manufacturing the same in which relative positioning accuracy between the lead member and the mounting member can be improved and the connection strength between the lead member and the mounting member can also be improvded.
SOLUTION: The lead frame 1 is provided with a lead member 10 having a connection hole 12o at an end 12e of a support lead 12, and a mounting member 20 having a mounting hole 21 to which the end 12e of the support lead 12 at the lead member 10 is inserted. The end 12e of the support lead 12 of the lead member 10 is inserted to the mounting hole 21 of the mounting member 20, and a caulked projection 22 which is formed by pressing a part of the mounting member 20 is inserted with pressure into the coupling hole 12o of the support lead 12. Accordingly, the support lead 12 can be coupled with the caulking process to the mounting member 20.
Inventors:
Atsushi Kushiba
Application Number:
JP2002262961A
Publication Date:
December 06, 2006
Filing Date:
September 09, 2002
Export Citation:
Assignee:
Mitsui High Tech Co., Ltd.
International Classes:
H01L23/48; H01L23/50; (IPC1-7): H01L23/50; H01L23/48
Domestic Patent References:
| JP54049065A | ||||
| JP61079297A | ||||
| JP53105674U |
Attorney, Agent or Firm:
Takahisa Kimura