PURPOSE: To provide a lead frame, which particularly enables a high quality multi-plastic package to be manufactured, in a lead frame used for constituting a semiconductor device by encapsulating a semiconductor chip in a plastic package made of a molded resin.

CONSTITUTION: A lead frame is made up of a plurality of lead frame bodies 15 arranged in parallel by means of a strip-shaped coupling board 16, wherein the lead frame body contains basic lead frames 14, each building up one semiconductor device and including a die-stage 11 on which a semiconductor chip is mounted and an inner lead 12 for electrically connecting this semiconductor chip. This lead frame is interspersed with apertures 16a and slits 16b, which communicate with the aperture and extend to the vicinity of the die stage, on the coupling board 16.