Title:
LED素子搭載用リードフレーム、樹脂付リードフレーム、半導体装置の製造方法、および半導体素子搭載用リードフレーム
Document Type and Number:
Japanese Patent JP5365751
Kind Code:
B2
Abstract:
A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.
Inventors:
Kazunori Oda
Masaki Yazaki
Masaki Yazaki
Application Number:
JP2013001119A
Publication Date:
December 11, 2013
Filing Date:
January 08, 2013
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H01L33/62
Domestic Patent References:
| JP2005353700A | ||||
| JP2010171218A | ||||
| JP2007134376A | ||||
| JP2010199166A | ||||
| JP200337236A | ||||
| JP750312A |
Foreign References:
| WO2008139981A1 |
Attorney, Agent or Firm:
Hirohito Katsunuma
Hiroyuki Nagai
Katsuomi Isogai
Yukihiro Hotta
Takuhisa Murata
Hiroyuki Nagai
Katsuomi Isogai
Yukihiro Hotta
Takuhisa Murata