To provide a lead frame of a semiconductor device in which a hook not connected with the inside and capable of pulling out, and to provide a semiconductor manufacturing method and a semiconductor device which can be easily manufactured and do not generate an electrical short circuit.

A lead frame of the present invention comprises a die pad, inner leads, outer leads, tie bars, and an outer frame. The lead frame is provided with hooks each protruded from the outer frame. The hooks are embedded in a resin encapsulated package after resin molding and each tapered toward the tip along a protrusion direction. Further, a semiconductor device manufacturing method of the present invention comprises deforming the hooks of the lead frame, embedded in the resin encapsulated package, in a vertical direction; and shifting the hooks in a horizontal direction to pull out from the resin encapsulated package.