PURPOSE: To smooth the cutting and molding process of a lead frame with favorable workability, and to prevent the completed semiconductor device from generation of inferiorly external appearance by a method wherein the roots of suspending leads of two pieces to connect an island to mount a semiconductor element to a frame part are formed in a fork type respectively.

CONSTITUTION: Because the suspending lead 12 is formed in the fork type at the roots on the frame part 4 side and is supporting the island, they are not torn off simply at the roots. Moreover although stress according to the lead frame itself and sealing resin is applied, the suspending lead 12 absorbs stress thereof, and because a resin sealed body 5 is in parallel with the surface of the lead frame, inclining deformation as usual is not generated, and at the cutting and molding process of outside leads 3, because the resin sealed body 5 flows smooth without caught by a cutting and molding metal mold, workability is enhanced and damage of the metal mold, etc., are not generated. Moreover, bacause the suspending lead 12 is cut rightly at the roots of the resin sealed body 5 by the cutting metal mold without torn off at the roots on the frame part side, inferiorly external appearance of protrusion of the suspending lead 12 is not generated at all.