PURPOSE: To make resin not flow out to the outer lead piece exceeding an allowable range by a method wherein a through hole is installed in a coupling piece and a groove part connecting to a through hole is installed in an outer lead piece, respectively.

CONSTITUTION: A semiconductor chip setting part 1, an outer lead piece 2, a coupling piece 3 which mutually couples outer lead pieces 2, and a frame 4 are installed in a lead frame for a semiconductor system. And a through hole 6 is formed in the coupling piece 3 and a groove part 7 connecting to the through hole 6 is formed in each outer lead piece 2. With this, when a resin mold is performed by placing a lead frame in a metallic mold, it is possible that a leaked resin from the gap between the lead frame and the metallic mold passes through the groove part 7 to be pooled in the through holes and the resin does not run out to the outer lead piece 2 exceeding an allowable range, thus, enabling to improve the yield of a product.