Title:
LEAD FRAME
Document Type and Number:
Japanese Patent JPH01171258
Kind Code:
A
Abstract:
PURPOSE:To maintain a stable state without inclination even when a semiconductor device is loaded onto a die pad by fitting a support lead supporting the die pad on the side where there are few suspension leads to the axis of symmetry passing through the center of the die pad. CONSTITUTION:A support lead 4 fixed to inner leads 3 with an insulating tape 5 is mounted on the side where there are fewer suspension leads 2 to the axis of symmetry Y-Y passing through the central point O1 of a die pad 1. The support lead 4 is connected to the die pad 1, and is not inclined to the B side even when a semiconductor device is loaded onto the die pad 1, and a stable state can be kept. To conduct the easy wire bonding operation of the semiconductor device and a lead frame, the suspension leads 2 and the support lead 4 are bent, and shaped so that the die pad 1 is positioned where lower than the inner leads 3.
Inventors:
MORI RYUICHIRO
Application Number:
JP33253787A
Publication Date:
July 06, 1989
Filing Date:
December 25, 1987
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/50; (IPC1-7): H01L23/50
Attorney, Agent or Firm:
Masuo Oiwa (2 outside)
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