Title:
LEAD FRAME
Document Type and Number:
Japanese Patent JPH0199247
Kind Code:
A
Abstract:
PURPOSE: To arbitrarily set characteristic impedance of a lead and to reduce a noise due to reflection by broadening a die pad to the lead, and inserting a dielectric between the lead and the pad.
CONSTITUTION: A dielectric 7 is interposed between a die pad 1 and leads 2, 3, and an IC chip 4 is bonded by a bonding material 6 to the pad 1 to be secured. A dielectric wiring is connected to the pad 1 and the leads 2, 3 on the chip 4. Accordingly, the characteristic impedances of the leads 2, 3 are arbitrarily set according to the specific permittivity of the dielectric 7, the distance of the leads 2, 3 and the pad 1, and further the width, thickness of the leads 2, 3. Thus, a noise due to reflection is reduced.
Inventors:
OKIDAKA TAKENORI
Application Number:
JP25862987A
Publication Date:
April 18, 1989
Filing Date:
October 13, 1987
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/50; H01L21/52; (IPC1-7): H01L21/52; H01L23/50
Attorney, Agent or Firm:
Masuo Oiwa (2 outside)
Next Patent: JPH0199248