Title:
LEAD FRAME
Document Type and Number:
Japanese Patent JPH05251531
Kind Code:
A
Abstract:
PURPOSE: To test a function of a lead without contacting adjacent leads when the size of a semiconductor product is reduced.
CONSTITUTION: A lead for measurement 6 is formed into one body with a lead 5 of a lead frame on the extention line of the lead 5. The lead for measurement 6 is formed wider than the lead 5. Even if a pitch of the leads 5 gets smaller along with the size reduction of a semiconductor product, a function test can be conducted with a contact pin for measurement without causing the contact pin for measurement to be brought into contact with the other leads 5 and the complication of a measurement jig and the facility can be prevented.
Inventors:
TAKEDA YUJI
Application Number:
JP8326392A
Publication Date:
September 28, 1993
Filing Date:
March 05, 1992
Export Citation:
Assignee:
NEC YAMAGATA LTD
International Classes:
H01L21/66; (IPC1-7): H01L21/66
Attorney, Agent or Firm:
Toshi Inoguchi