Title:
LEAD FRAME
Document Type and Number:
Japanese Patent JPH07147362
Kind Code:
A
Abstract:
PURPOSE: To provide a lead frame which has an excellent heat radiating property and can be easily manufactured and the cost of which can be reduced.
CONSTITUTION: In a lead frame 10 formed in a required pattern by piling up plated films on a base material by electro-forming, a stage section 18 for mounting a semiconductor element is formed thicker than inner leads 16 by piling up multiple plated films.
Inventors:
FUKASE KATSUYA
Application Number:
JP29497593A
Publication Date:
June 06, 1995
Filing Date:
November 25, 1993
Export Citation:
Assignee:
SHINKO ELECTRIC IND CO
International Classes:
C25D1/00; H01L23/50; (IPC1-7): H01L23/50; C25D1/00
Attorney, Agent or Firm:
Takao Watanuki (1 outside)
Previous Patent: Abnormality diagnosis program and abnormality diagnosis method
Next Patent: tailgate
Next Patent: tailgate