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Title:
LEAD FRAME
Document Type and Number:
Japanese Patent JPS5615057
Kind Code:
A
Abstract:

PURPOSE: To enable machining and fabrication of an inner lead frame accurately by forming a connector having a curved opening at the ends of the lead wires of the lead frame and removing the connector substantially simultaneously upon formation of the lead frame.

CONSTITUTION: Inner leads 9 and the ends of the lead 9 are retained and machined to form bumps 13 at the ends of the lead wires of inner lead wires 8 having polyimide supporting frame 12, and a connecting cushion 10 is finally removed. Accordingly, even if external force is loaded at the time of holding and stamping for machining, the inner lead wire 9 may neither be bent nor displaced the position due to the provision of the cushion 10 thereat.


Inventors:
BONSHIHARA MANABU
Application Number:
JP9124779A
Publication Date:
February 13, 1981
Filing Date:
July 18, 1979
Export Citation:
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Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L23/50; H01L23/498; (IPC1-7): H01L23/48



 
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