Title:
LEAD FRAME
Document Type and Number:
Japanese Patent JPS5874064
Kind Code:
A
Abstract:
PURPOSE: To prevent breakage and deformation, by forming sprocket hole parts of a tape carrier system lead frame of hard material.
CONSTITUTION: On the both sides of an insulated film 1 of a tape polyimide, etc., parts 6 formed of hard material such as a metal are provided at equal intervals, and sprocket holes 2 are formed at the center thereof. In this manner, since the sprocket holes are not broken and deformed by the mechanical strength, the pitch slippage is eliminated resulting in the further improvement of the workability and yield.
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Inventors:
NAKAMORI SUSUMU
Application Number:
JP17430681A
Publication Date:
May 04, 1983
Filing Date:
October 29, 1981
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/60; H01L23/495; (IPC1-7): H01L23/48
Domestic Patent References:
| JPS5321567A | 1978-02-28 | |||
| JPS52102675A | 1977-08-29 |
Attorney, Agent or Firm:
Shin Uchihara