PURPOSE: To eliminate the need for solder plating and tinning to an outer lead section after a sealing, to prevent an intrusion into a package of moisture from the interface and to improve reliability by joining plastics and a lead frame through a solder paste layer.

CONSTITUTION: Silver or gold partial plating 14 is executed to the noses of the inner lead sections 13 of a lead frame 11 and on a chip bonding section 12, and solder paste layers 19 are formed around the inner lead sections 13 and to outer lead sections 18 in a ring shape. Numerals 15 represents a semiconductor element loaded on the chip bonding section 12 to which silver or gold partial plating 14 is executed, 16 wire bondings and 17 a seal resin layer.