Title:
リードフレーム及び半導体装置
Document Type and Number:
Japanese Patent JP7100275
Kind Code:
B2
Abstract:
A lead frame of high quality which can endure direct bonding to a semiconductor element, and a semiconductor device of high reliability which utilizing the lead frame. A lead frame includes a plurality of connected units, each unit including a pair of lead portions arranged spaced apart and opposite from each other, for mounting a semiconductor element and electrically connecting to a pair of electrodes of the semiconductor element respectively. The lead portions respectively include an element mounting region arranged on a surface thereof to mount the semiconductor element, and a groove extending from opposing end surfaces of each of the pair of lead portions, in a direction away from the end surfaces and bending in a surrounding manner along outer periphery of the element mounting region.
Inventors:
Takuya Nakabayashi
Yoshinao Bando
Hiroto Tamaki
Yoshinao Bando
Hiroto Tamaki
Application Number:
JP2020022251A
Publication Date:
July 13, 2022
Filing Date:
February 13, 2020
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01L33/62; H01L23/48
Domestic Patent References:
| JP2007134376A | ||||
| JP2011146524A | ||||
| JP2011176265A | ||||
| JP2012033756A |
Foreign References:
| US20120273819 |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation