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Title:
LEAD-FREE FUSIBLE ALLOY TYPE THERMAL FUSE
Document Type and Number:
Japanese Patent JP2007031775
Kind Code:
A
Abstract:

To provide a lead-free fusible alloy type thermal fuse having Sn-Bi based alloy as the main composition for temperature sensing element and 130-135°C acting temperature.

The low melting point fusible alloy 3 contained by adding or partially replacing 1 wt.% Ag and In or Ga into a binary alloy of 42Sn-58Bi as the base body alloy composition, is joined with a resistance welding with one pair of lead members 1, 2 composed of Sn-Cu plated copper wire. Flux 4 composed of rosin, wax and activators, is coated on the surface of the low melting point fusible alloy 3, and thereafter, this is held into an insulating case 5 of a ceramic porcelain tube, such as alumina, and constituted by sealing both end parts of the insulating case 5 while remaining the delivering parts of the lead member 1, 2 with heat resistant sealing members 6, 7 of epoxy resin and inorganic additive.


Inventors:
Terasawa, Kiyotomo
Ishida, Kiyohito
Onuma, Ikuo
Application Number:
JP2005000216781
Publication Date:
February 08, 2007
Filing Date:
July 27, 2005
Export Citation:
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Assignee:
NEC SCHOTT COMPONENTS CORP
TOHOKU UNIV
International Classes:
C22C12/00; H01H37/76; C22C12/00; H01H37/00