Title:
LEAD-FREE INSULATING COATING MATERIAL
Document Type and Number:
Japanese Patent JP2008303076
Kind Code:
A
Abstract:
To provide a lead-free insulating coating glass material which can be melted at low temperature and has high water resistance, in the development of an electronic material substrate typified by a load sensor.
The lead-free insulating coating glass material contains, by whight, 3-23% SiO2, 1-7% B2O3, 1-7% ZnO, 0-10% BaO, 60-88% Bi2O3, and 0.1-5% Al2O3. A lead-free insulating coating material comprising powder of the glass and a filler of ceramic powder is also provided. The lead-free insulating coating glass material and the lead-free insulating coating material have a softening point of 350-480C and an average thermal expansion coefficient at 30-300C of (85-130)10-7/C.
Inventors:
HAMADA JUN
HAYAKAWA NAOYA
NAKAYA KAZUTOSHI
HAYAKAWA NAOYA
NAKAYA KAZUTOSHI
Application Number:
JP2007149022A
Publication Date:
December 18, 2008
Filing Date:
June 05, 2007
Export Citation:
Assignee:
CENTRAL GLASS CO LTD
International Classes:
C03C8/04; C03C8/16; G01G3/13
Domestic Patent References:
| JP2002241143A | 2002-08-28 | |||
| JP2004238273A | 2004-08-26 | |||
| JP2006169047A | 2006-06-29 | |||
| JP2004142982A | 2004-05-20 | |||
| JP2005247602A | 2005-09-15 | |||
| JP2005172530A | 2005-06-30 | |||
| JP2008030994A | 2008-02-14 | |||
| JP2007176726A | 2007-07-12 |
Attorney, Agent or Firm:
Yoshiaki Hanada