Title:
LEAD-FREE THERMAL FUSE
Document Type and Number:
Japanese Patent JP3901028
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To provide a lead-free thermal fuse excellent in operational reliability in the range of 75-85°C which contains no lead or cadmium causing environmental problems.
SOLUTION: In the thermal fuse with a low melting point fusible alloy as a fuse element, the low melting point fusible alloy is a ternary alloy having a composition consisting of, by weight, 50-60% Bi, 20-30% In and the balance Sn. If necessary, 0.1-5 pts.wt. Cu, or 0.1-5 pts.wt. Ag is added to 100 pts.wt. ternary alloy.
Inventors:
Terasawa, Kiyotomo
Application Number:
JP2002000172764
Publication Date:
January 12, 2007
Filing Date:
June 13, 2002
Export Citation:
Assignee:
NEC SCHOTT COMPONENTS CORP
International Classes:
C22C12/00; H01H37/76; C22C12/00; H01H37/00; (IPC1-7): C22C12/00; H01H37/76
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