LEAD-LESS CHIP CARRIER AND ITS MANUFACTURE

Title:

LEAD-LESS CHIP CARRIER AND ITS MANUFACTURE

Document Type and Number:

Japanese Patent JP3509239

Kind Code:

B2

Abstract:

PURPOSE: To provide a lead-less chip carrier and its manufacturing method whereby the electroconductions between the surface and rear surface of an insulation board can be performed surely.
CONSTITUTION: A plurality of pads 11 provided on both the surface and rear surface of an insulation board 7, a plurality of protrusive surfaces 71 provided on the side surfaces of the insulation board 7, and a plurality of groove parts 75 recessed from the protrusive surfaces 71 are provided respectively. The surfaces of the protrusive surfaces 71 are covered with side-surface conductors 1 performing electroconductions through the pads 11. In the case of the manufacturing of an LCC (lead-less chip carrier) 3, first, the inside walls of slits for making the peripheral edge parts of the insulation board 7 into individual pieces are covered with metallic plating films, and further, metallic band-form parts are formed along the peripheral edge parts of the insulation board 7. Subsequently, both the inside walls of the slits for making the peripheral edge parts of the insulation board 7 into individual pieces and the metallic band-form parts are notched at fixed spaces. Thereby, a plurality of groove parts 75 are provided, and in addition to these, a plurality of side-surface conductors 1 each of which is formed between the groove parts 75 and has residual metallic plating film and a plurality of pads 11 which are connected respectively with the respective side-surface conductors 1 are formed respectively.

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Inventors:

Sato, Tsutomu
Furuta, Toru

Application Number:

JP29577394A

Publication Date:

March 22, 2004

Filing Date:

November 04, 1994

Export Citation:

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Assignee:

IBIDEN CO LTD

International Classes:

H01L23/12; (IPC1-7): H01L23/12

Attorney, Agent or Firm:

高橋祥泰

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