Title:
LEAD MATERIAL FOR ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2001257303
Kind Code:
A
Abstract:
To provide a lead material for electronic components which will not cause the problem of an environment contamination with lead.
The surface of the lead material 1 made of copper, its alloy, iron, its alloy, or the like is coated with a tin-copper alloy plating layer 2 containing 0.4 to 5.0 wt.% copper.
Inventors:
NAKAMURA TOSHINOBU
CHINDA SATOSHI
CHINDA SATOSHI
Application Number:
JP2000073939A
Publication Date:
September 21, 2001
Filing Date:
March 13, 2000
Export Citation:
Assignee:
HITACHI CABLE
International Classes:
C25D7/00; C22C13/00; C22C38/00; H01L23/48; H01L23/50; (IPC1-7): H01L23/50; C22C13/00; C22C38/00; C25D7/00; H01L23/48
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